Flip Chip Bonder Market Size, Share, Growth, and Industry Analysis, By Type (Fully Automatic, Semi-Automatic) By Application (IDMs, OSAT) Regional Forecast From 2025 To 2034

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FLIP CHIP BONDER MARKET OVERVIEW

The global Flip Chip Bonder Market size stood at USD 0.33 billion in 2025, growing further to USD 0.46 billion by 2034 at an estimated CAGR of 3.78% from 2025 to 2034.

The United States Flip Chip Bonder Market size is projected at USD 0.11006 billion in 2025, the Europe Flip Chip Bonder Market size is projected at USD 0.07954 billion in 2025, and the China Flip Chip Bonder Market size is projected at USD 0.09281 billion in 2025.

A flip chip bonder is also popularly known as controlled collapse chip connection. Shortly it is also known as C4. This equipment is basically used for the purpose of interconnecting dies with one another. Some of the dies include semiconductor devices, integrated passive devices, and IC chips. These dies are connected to external circuitry with the aid of solder bumps.

Emergence of technologies like smart factories, smart grids, and smart manufacturing are increasing the need to use flip chip bonders. This is identified as the latest trend in the market currently.

They are also used within the architecture of microelectromechanical system sensors. The use of wire bonds can be reduced with the help of flip chip bonding. All of these factors play a major role in propelling the flip chip bonder market growth.

KEY FINDINGS

COVID-19 IMPACT

Growing Use of Gadgets During Pandemic Increased Market Share

The outbreak of COVID-19, was the reason for a lot of chaos in most of the markets all over the world. There was a major disruption in the order of operation. Due to the increasing rate of infections, and death rates, work from home was sanctioned to most of the employees.

As many people had to work from their respective homes, usage of electronic gadgets like computers, laptops, smartphones. PCs, and tablets became an essential. With increasing consumption of electronic gadgets, the market for flip chip bonder also witnessed a steady growth during the pandemic period.

LATEST TRENDS

Rising Demands from IoT Sectors to Promote Market Growth

One of the latest technologies that is being incorporated in all of the sectors is Internet of Things also known as IoT. Incorporating IoT helps in increasing the efficiency of the performance. With growing usage of this technology, the requirements and demands from IoT sectors have also increased.

Some of the new advancements that have been noticed recently are smart factories, smart grids, and smart manufacturing. The emergence of such technologies has again increased the demand for IoT based devices. In turn the requirement of sensors has also grown. Portable sensors are convenient to be used. Flip chip bonders are very helpful in decreasing the size or miniaturizing sensors. All of these are considered as the latest trend in the market.

• • The U.S. advanced-packaging R&D program opened five funded pillars (equipment, power/thermal, connectors incl. photonics/RF, chiplets, co-design/EDA) under a ~$1.6 billion NOFO, according to NIST.

• • Sub-micron placement and ~2 µm-class redistribution/feature targets are emphasized for 2.5D/3D packages, tightening bonder tolerance windows, according to IEEE’s HIR.

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FLIP CHIP BONDER MARKET SEGMENTATION

By Type

The market can be divided on the basis of type into the following segments:

Fully automatic, and, semi-automatic. The fully automatic segment is anticipated to dominate the market during the forecast period.

By Application

Based on application, the market share is bifurcated into the following segments:

IDMs, and, OSAT. The IDMs segment is expected to dominate the market during the forecast period.

DRIVING FACTORS

Integration of Flip Chip Architecture in MEMS Sensors to Amplify Market Growth

As flip chip bonders are very useful in miniaturizing sensors, they are also used within the architecture of MEMS sensors which are also known as microelectromechanical system sensors. This is an important factor that is driving the market growth.

Flip chip bonds can also be used as packaging materials especially for electronic items. Some of the electronic items include infrared sensors, integrated circuits, optical devices, SAW devices also called as surface acoustic wave devices, and detector arrays. These bonds are in high demand in the electronic industry. This can positively impact the development of the market.

High Suitability of Flip Chip Bonders to High Frequency Components to Impede Market Growth

Flip chip bonding has several advantages. They are highly suitable for components that are made up of high frequency. The number of electric connections that are made up using these bonds is very high. As many connections can be done in a particular area, it is very helpful in increasing the packaging layout flexibility.

The use of wire bonds can be reduced with the help of flip chip bonding. When flip chi bonds are used the size of the package also reduces. The electric performance provided by these bonds is of superior quality as they have the ability to produce connections with lower parasitic inductance. All of these factors are prone to bring vast growth for the flip chip bonder market share.

• Europe’s IPCEI ME/CT mobilizes €8.1 billion public funding for chips (incl. advanced packaging), catalyzing new flip-chip lines, according to the European Commission.

• The U.S. NAPMP finalized $1.4 billion in awards, including ~$300 million in materials/substrates and $1.1 billion for a national pilot facility, according to NIST.

RESTRAINING FACTORS

Lack of Carriers in Flip Chip Bonders to Bring Down Market Share

These bonders are used in electronic industries as primary equipments as they help in carrying out various processes. However, one of the drawbacks of this device is that they lack carriers. This can be a major factor disrupting the market growth and development.

When there are no carriers present in the bonders they cannot be subjected to easy replacement. Problems will have to be faced even during the procedure of manual installation. These bonders must always be propped or mounted on surfaces that flat. Finding flat surfaces every single time can be challenge. All of these factors pose a threat to market growth.

• Assembly & packaging tool budgets contracted from $5.4 B (2024) to $3.4 B (2025), delaying some bonder procurements.

• Rising package/test complexity (e.g., multi-die, high-I/O, RF/optical) spikes capital and process-integration risk across 5 R&D areas.

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FLIP CHIP BONDER MARKET REGIONAL INSIGHTS

Asia Pacific to Dominate Market Share in Upcoming Years

The region that is predicted to witness tremendous growth and occupy the largest share in the market will be Asia Pacific. The APAC region will account for almost one-fourth of the market share.  The important country that will help in growing the market in APAC is China.   

China is one of the biggest markets for flip chip bonders. Other than this the growth of the market can be attributed to the increasing necessity of such bonders in electronic industry. Many other sectors like aerospace, automotive, and, telecommunication is also adopting the use of such bonders. All of these factors have increased the growth of market in Asia Pacific region.

KEY INDUSTRY PLAYERS

Leading Players adopt Acquisition Strategies to Stay Competitive

Several players in the market are using acquisition strategies to build their business portfolio and strengthen their market position. In addition, partnerships and collaborations are among the common strategies adopted by companies. Key market players are making R&D investments to bring advanced technologies and solutions to the market.

• Hanmi (Hanmi Semiconductor): Korean back-end tool maker; part of the Asian equipment cohort benefiting from government chip support packages (KRW 26 trillion) in 2024, according to AMRO/MoEF reporting.

• K&S (Kulicke & Soffa): Reported 2,681 full-time employees as of Sept 28, 2024, underscoring scale in bonders and die-attach, according to its 2024 Form 10-K.

List of Top Flip Chip Bonder Companies

• Hamni
• K&S
• BESI
• ASMPT
• SET
• Athlete FA
• Muehlbauer
• AMICRA Microtechnologies
• Shibaura

REPORT COVERAGE

The report provides an insight into the industry from both the demand and supply sides. Further, it also gives information on the impact of COVID-19 on the market, the driving and the restraining factors along with the regional insights. Market dynamic forces during the forecast period have also been discussed for the better understanding of the market situations. List of key industry players have been listed down to understand the competition in the market.