Thermocompression Bonding (TCB) is termed as a wafer bonding procedure and is also stated as thermocompression welding, pressure joining, diffusion bonding, or solid-state welding. This technique empowers internal structure security device packages and direct electrical interconnect arrangements without added steps alongside the surface mounting procedure. Thermocompression bonding is a chip installed technology under examination and application in numerous platforms. The global market is fueled by augmented TCB bonder utilization, memory applications, followed by logic devices. In the meantime, TCB bonder is attaining market share from wire bond assembly techniques. Likewise, lower output and greater processing prices are hindrances in the TCB technology.
Business Research Insights states that the global TCB bonder market size was US$ 93 million in 2021 and market is projected to touch USD 315.5 million by 2028, exhibiting a CAGR of 19.1%
Impact of COVID-19 on the Market
Since the outbreak of the COVID-19 pandemic, the virus has succeeded in spreading to every region across the world, and thus the World Health Organization declared it as a public health crisis. The global effects of the coronavirus were witnessed by nearly each sector during the first half of 2020.
Furthermore, the pandemic impacted the demand for chief applications of these bonders such as in CMOS, logic equipment, semiconductors, circuits, and others, which contributed to the drop of product adoption and affected market growth.
Automatic TCB Bonder
An automatic TCB bonder is a device with multi-axis motion and manifold gears to accomplish bonding processes, comprising placing die on substrates, and filling epoxy into the space between two dies or die/substrate. These bonders also have accuracy alignment junctures that are able to align chips onto substrates in x, y, and z paths before moving them underneath the wire bonder head for consequent ball bump creation.
Manual TCB Bonder
Manual TCB bonders are utilized in the semiconductor sector for wafer bonding, die bestowing, and in additional microelectronics. A manual thermocompression bonder is a classification that offers TCB with domestic electrical heating and allots competence. The manual TCB bonding system is an incorporated medium through which several types of compounds can be amalgamated on the substrates through thermosonic or thermocompression methods.
Below mentioned is the list of players that operate in the market.
1. ASM Pacific Technology (Amicra)
ASM Pacific Technology is the world’s dominating provider of semiconductor assembly and SMT equipment with a global existence in over 30 nations. As the group that gained revenue of USD 2.25 billion in 2017, ASMPT now possesses 11 production units in Germany, China, Singapore, Hong Kong, Malaysia, the Netherlands, and the U.K.
2. Kulicke & Soffa
Kulicke & Soffa (K&S) is a dominating supplier of semiconductor packaging and electronic assembly solutions sustaining the global automotive, communications, consumer, computing, and manufacturer segments. As a leader in the semiconductor zone, K&S has offered customers with market dominating packaging solutions for years. In the past few years, K&S has extended its product offerings through tactical procurement and organic expansion, electronics assembly, providing advanced packaging, wedge bonding, and an expansive assortment of dispensable apparatuses to its core offerings.
3. BE Semiconductor Industries N.V.
BE Semiconductor Industries N.V., simply called Besi, is a Dutch international corporation that structures and produces semiconductor devices. The company was established in May, 1995 by Richard Blickman, who continues to dominate the company in current times. The corporation employs 2,040 people, among which 200 are working at its headquarter office in Duiven, a small township in the eastern part of the Netherlands. It delegates manufacturing responsibility to its branches located in China as well as Malaysia.
4. Smart Equipment Technology (SET)
Established in 1975, SET is the world’s pioneering provider of great precision Flip-Chip bonders and resourceful Nanoimprint Lithography (NIL) solutions. With Flip-Chip bonders installed across the globe, SET is well-known for the incomparable sub-micron accurateness and the flexibility of its devices.
5. HANMI Semiconductor Co., Ltd.
HANMI Semiconductor Co., Ltd. produces and creates semiconductor equipment. The company's portfolio involves auto molding system, sawing & placement system, compress trim/form/singulation system as well as pick & place system. The establishment was founded in 1980 by N. K. Kwak, who is the chairman of HANMI.
Factors Driving the Market Growth
The growth aspects of the market for TCB bonder are predominantly attributed to the rising demand for reduction and higher density in electronic devices, the surging trend of progressive packaging, and the increasing requirement for dependability and high-quality products. Technological progressions in bonding equipment, such as the presentation of automatic bonders and the development of novel adhesive chemistries, are also making significant contributions toward the growth of the market.