TCB Bonder Market Size, Share, Growth, Trends, Global Industry Analysis By Type (Automatic TCB Bonder and Manual TCB Bonder), By Application (IDMs and OSAT), Regional Insights and Forecast From 2025 To 2033

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TCB BONDER MARKET REPORT OVERVIEW

The global TCB bonder market size was USD 0.101 billion in 2024 and market is projected to touch USD 0.364 billion by 2033, exhibiting a CAGR of 15.1% during the forecast period from 2025 To 2033.

A TCB bonder is also known as a wire bonder, chip bonder, or lead bonding device that electrically joins a printed wiring board (PWB) and integrated circuit (IC) package. Thermo-compression bonding (TCB) provides high accuracy. This technology uses thermal processing utilization through the melting point of various types of synthetic fibers. It uses heat and applies mechanical and thermal pressure to join two bodies. It uses metal wires to connect PWB and IC packages. Wires that are used to connect the ICB and PWB are called tungsten due to their high-melting-point.

TCB bonder finds its applications due to the rising demand for electronic devices of high density and miniaturization. Due to the rise in inclination towards advanced packaging and reliability on superior and quality products. Thermo-compression bonding is used in the complementary metal-oxide-semiconductor (CMOS) industry and vertically integrated devices. This bonding is used for producing accelerometers, pressure sensors, Radio Frequency Microelectromechanical systems (RF MEMS), and gyroscopes. It is generally used in high-reliability applications.

COVID-19 IMPACT

"Halt on Operations to Impede Product Demand"

The outbreak of COVID-19 is already being felt around the world, and the global TCB bonder market is considerably impacted. In 2020, COVID-19 had a negative impact on the market. Several countries went into lockdown. With the sudden pandemic, all kinds of businesses witnessed disruptions. Manufacturing of the devices that use thermal compressing was impacted due to limited capacities of production and halting of supply chains. As the main application of such bonders comes from the CMOS, circuits, semiconductors, logic devices, and many more, the pandemic had a significant impact on demand for such devices due to the halting of operations. Henceforth, the usage of these bonders was also halted for a period of time. This has negatively impacted the demand for TCB bonds as the existing production was halted and no new production lines were started.

LATEST TRENDS

"Adoption of Non-Conductive Films to Propel Demand"

The trend that can impact the global TCB bonder market is the adoption of non-conductive films (NCFs). Non-conductive films have been in development as a replacement for liquid preap-pilled underfill materials. These films have been introduced to prevent problems arising such as void trapping and flux residues in fine-pitch interconnection. To increase the productivity in the assembly of advanced packaging, a reduced thermos-compression time is needed. NCFs made with faster curing speeds have been introduced to get a higher degree of cure of NCFs. This has led to an increase in faster-curing speed with the same bonding temperature. Using isothermal bonding with a faster curing speed has further reduced the bonding time and there were micro bumping interconnections. These advances in bonders are expected to generate an increase in demand as it will have increased applications in the industries.

TCB BONDER MARKET SEGMENTATION

By Type

According to type; the market is divided into automatic TCB bonder and manual TCB bonder.

Automatic TCB bonder is expected to lead the type segment of the market owing to the rise in the semiconductor industry. Due to the growing demand for semiconductors from various industries and respective companies.

By Application

Based on the application; the market is divided into IDMS and OSAT

OSAT is expected to lead this segment due to the significant growth of third-party vendors to make semiconductors. They have expanded their capabilities from water probe, packaging services, final testing, and die/sort assembly.

DRIVING FACTORS

"Use of Thermo-compression in Wire Bonding to Drive Demand"

The global TCB bonder market growth is owed to its applications in wire bonding. Thermo-compression uses heating, mechanical pressure, and thermal application to join two bodies. There is a rising need for miniaturization and high-density electronic devices of high quality. Wire bonding is used in the semiconductor and microelectronics industry to meet manufacturing requirements. Where companies use it to develop customized technological solutions by providing high-density electronics. The bonder is used to make semiconductors and microelectronics to connect silicon chips and semiconductor devices for the development of logic devices. TCB is also used to make digital circuits and further advances in wire bonding technologies are expected to drive the demand for the market globally.

"Rising Demand for OSAT to Expand Market Exponentially"

The TCB bonders are used in outsourced assembly and test (OSAT) vendors, which provide third-party IC packaging. IC packaging is a package surrounding circuit material that prevents any damage. Increasing demand for semiconductors is driving the demand for OSATs and subsequently for TCBs are also used by OSATs. This is done to reduce internal manufacturing costs. They use advanced wire bonding techniques for advanced packaging. TCBs are used in advanced packaging making the devices more sophisticated and protected.

RESTRAINING FACTORS

"High Prices of TCBs to Hamper Market Growth"

Restraining factors such as high prices, can hinder the market demand. The costs of thermo-compression bonding equipment are high which can lead to high internal manufacturing costs. Also, OSATs can charge quite high prices for their third-party services which can hold some companies back to buy semiconductors which can hinder the market’s growth.

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TCB BONDER MARKET REGIONAL INSIGHTS

"North America to Dominate Market Owing to Presence of Numerous Companies"

North America holds a major part in the global TCB bonder market share in terms of revenue. It is also expected to have considerable growth due to the presence of numerous well-established semiconductor companies. Companies like Intel Corporation, Micron Technology, Inc., and many more. The region also has headquarters and main offices of other region-originated companies which also contributes to the market’s growth.

Europe holds the second largest market share due to the rising demand for high-quality electronic devices in the automotive industry.

Asia Pacific region is the fastest-growing region owing to the numerous semiconductor manufacturers in countries like Japan and China. Moreover, the rising demand for electronic devices in countries like South Korea, Taiwan, and India is also contributing to the market’s growth.

KEY INDUSTRY PLAYERS

"Key Players to Boost Demand Leading to Market Growth"

The report delivers information about the list of market players and their working in the industry. The information is collected and reported with proper research, technological developments, acquisitions, mergers, expanding production lines, and partnerships. Other aspects examined for the global TCB bonder material market include companies producing and introducing new products, regions they conduct their operations in, automation, technology adoption, generating the most revenue, and making a difference with their products.

List of Top TCB Bonder Companies

• ASM Pacific Technology (Amicra) (Singapore)
• Kulicke & Soffa (Singapore)
• Besi (Netherlands)
• Shibaura (Japan)
• Smart Equipment Technology (SET) (France)
• HANMI Semiconductor (China)

INDUSTRY DEVELOPMENT

• January 2022: Advanced Micro Devices, an American-based semiconductor company is the first vendor to unveil the chips made from copper hybrid bonding. AMD has unveiled the first wave of chips that uses hybrid bonding technology. Companies like Intel and Samsung are also on the path to developing hybrid bonding.
• February 2021: ASM Pacific Technology Ltd (ASMPT) is the global leader in semiconductor solutions, has announced that it will ship its 250^th thermo-compression bonding tool to its customers.

REPORT COVERAGE

This research profiles a report with widespread studies that take into an explanation of the firms that exist in the market affecting the forecasting period. With detailed studies done, it also offers a comprehensive analysis by examining the factors like segmentation, opportunities, industrial developments, trends, growth, size, share, restraints, etc. This analysis is subject to alteration if the key players and probable analysis of market dynamics changes.