Advanced Packaging Inspection Systems Market Size, Share, Growth, and Industry Analysis, By Type (Optical Based Packaging Inspection Systems & Infrared Packaging Inspection Systems), By Application (Consumer Electronics, Automotive Electronics, Industrial, Healthcare & Others), Regional Insights, and Forecast To 2031

Updated On: 08 April 2024

Advanced Packaging Inspection Systems Market Report Overview

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The global advanced packaging inspection systems market size is USD 474.8 million in 2022 and is expected to reach USD 1471.93 million in 2031, exhibiting a CAGR of 6.3% during the forecast period.

Through the use of multi-mode optics, sensors, and sophisticated defect detection algorithms, advanced packaging inspection systems are intended to inspect advanced wafer-level packaging process steps and provide information on the full range of defect types for inline process control. Multiple devices (electrical, mechanical, or semiconductor) can be combined and packaged as a single electronic device thanks to advanced packaging inspection systems. Advanced packaging, in contrast to conventional electronic packaging, makes use of procedures and methods carried out at semiconductor fabrication facilities.

The packaging inspection systems assist FMCG producers in streamlining their manufacturing and packaging procedures, resulting in high-quality products without slowing down production. With less interference from labor and highly automated packaging machinery and packaging inspection systems, advanced packaging inspection systems and inspection processes have a tendency to be very productive. As opposed to randomly selecting a product from the batch to be checked by a quality inspector, this factor has established the trend of inspecting each and every product using packaging inspection systems.

COVID-19 Impact: Industry Imbalance Causes Market Distortion

The global COVID-19 pandemic has been unprecedented and staggering, with advanced packaging inspection systems market experiencing higher-than-anticipated demand across all regions compared to pre-pandemic levels. The sudden rise in CAGR is attributable to the market's growth and demand returning to pre-pandemic levels once the pandemic is over.

Manufacturers of semiconductors and electronics experienced issues as a result of the COVID-19 outbreak, including unstable markets, a decline in consumer confidence, and issues with import and export trade. The global supply chain includes the sourcing of raw materials, packaging, and distribution. Moving commodities, labels, and other items has become challenging as a result of lockdowns. The markets for semiconductors were affected financially in addition to having an immediate impact on markets, supply chains, supply and demand, and all of these other things. To address this urgent situation, manufacturers of semiconductors and electronics are focusing on securing their staff, operational procedures, and supply chains. The pandemic altered the dynamics of the industry, compelling organizations to redesign every aspect of their operational frameworks in order to preserve stability amidst the disturbances. Aside from that, the companies' business operations have been affected by the outbreak, which has an effect on the overall industry. This has partially impacted the advanced packaging inspection systems market.

LATEST TRENDS

"Fan Out Wafer Level Packaging to Boost the Market Growth "

An advancement in wafer-level advanced packaging inspection systems is fan-out wafer-level packaging, which is used for integrated circuits. Fan-out wafer-level packaging includes packaging integrated circuits while the wafer is still intact and then chopping, in contrast to traditional packaging methods where a wafer is first diced. This distinctive trend is the primary driver of market growth. Fan-out wafer-level packaging has a smaller package footprint and superior thermal and electrical performance compared to conventional packages. Fan-out wafer-level packaging also promotes numerous wafer contacts while minimizing the die size, which boosts market sales. Thus, it is anticipated that the fan out wafer level packaging will increase overall market sales. These new developments and varieties in product are mostly to blame for the market's overall growth.

Advanced Packaging Inspection Systems Market Segmentation

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• By Types 

Based on type, the market is classified into Optical Based Packaging Inspection Systems & Infrared Packaging Inspection Systems.

• By Application

Based on application, the market is categorized into Consumer Electronics, Automotive Electronics, Industrial, Healthcare & Others.

DRIVING FACTORS

"Food & Beverages Industry Gives the Market Extra Boost "

In order to ensure the quality and integrity of the finished product, the market is developing vision-based inspection systems that can efficiently detect mistakes on fast production lines. These cutting-edge packaging inspection systems can also perform a seal and cap inspection in addition to a full product inspection. Through label verification, batch coding verification, barcode verification, etc., it can also check the label's printing. Other innovative solutions provided by leading manufacturers include the "Glue Line Inspector," which examines the cold seal on food packaging to prevent contamination of the food inside, and the vision measuring system, which is used to check the level of liquid product in a transparent container. As a result, the growth, and the increasing demand of product in food & beverages industry will boost the market. It will contribute to the expansion of the semiconductor and electronics industry and it will improve the overall advanced packaging inspection systems market growth.

"Automated Factories to Accelerate Market Growth "

Leakage inspection, barcode inspection, production machine malfunction inspection, color inspection, seal inspection, metal detectors, and other inspections are boosting the market. As a result, modern packaging inspection systems can check the packaging in ways that a human cannot. Thus, the demand for sophisticated packaging inspection systems has increased as factories become more automated. The end-users are moving toward adopting six sigma technology and as a result require highly advanced packaging inspection systems technology to confirm the quality tag. This is due to the globally increasing competition among various industries in terms of making packaging with high consumer convenience, longer shelf life, and enhanced shelf appeal. The advancement of the product is helping the market to grow.

RESTRAINING FACTORS

"High Cost of Packaging to Impede the Market Growth "

Compared to the traditional packaging methods used in industry, advanced packaging is a very expensive process. Each new node requires expensive design and manufacturing costs at some points. Additionally, because of its complexity, the cost of fabrication is much higher. The overall cost of advanced packaging inspection systems is rising as a result of these obstacles. But as time goes on, this issue will be resolved in some way. If this problem is fixed, the market will start to grow right away.

Advanced Packaging Inspection Systems Market Regional Insights

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"North America Dominating the Market Across the Globe"

The market for advanced packaging inspection systems in North America has benefited from the region's expanding industrial development and a number of driving factors that have boosted the potential sectors because this region is the product's primary user. The consumer electronics, automotive electronics, industrial, healthcare industries rising product demand is the primary factor boosting advanced packaging inspection systems market share. Trends toward rapid urbanization will support the market as a whole even more.

KEY INDUSTRY PLAYERS

"Leading Manufacturers to Boost Product Demand"

The research provides details on the list of market participants and their activity in the sector. Acquisitions, mergers, technical advancements, collaborations, and increasing production facilities are used to gather and report the information. The companies that produce and introduce new products, the areas where they operate, automation, technology adoption, creating the greatest income, and making a difference with their products are some of the other factors that are looked at for this market.

List of Market Players Profiled

• KLA-Tencor (U.S.)
• Onto Innovation (U.S.)
• Cohu (U.S.)
• Camtek (Israel)

REPORT COVERAGE

The research goes into great detail about market segmentation by type and application. The study examines a broad range of participants, including current and potential market leaders. A sizable market expansion is anticipated as a result of a number of important factors. The research also examines factors that may increase the advanced packaging inspection systems market share in order to provide market insights. The report makes forecasts for market expansion over the anticipated time period. The objective of the regional research is to explain why one region dominates the global market. A number of properly taken into account factors prevent the industry from growing. The research also includes a strategic analysis of the market. It includes thorough market information.