Back Grinding Tapes (BGT) Market Size, Share, Growth, and Industry Analysis, By Type (UV and Non-UV), By Application (Standard, Standard Thin Die, (S) DBG (GAL), Bump), Regional Insights, and Forecast To 2031

Updated On: 01 April 2024

Back Grinding Tapes (BGT) Market REPORT OVERVIEW

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The global Back Grinding Tapes (BGT) market size was USD 219.5 Million in 2022 and market is projected to touch USD 349.5 Million by 2031, at a Compound Annual Growth Rate (CAGR) of 5.3%.

Back grinding tapes are used in semiconductor front-end operations to adhere to the circuit surface created on silicon wafers. While wafers' backs are being ground, they shield the circuits from debris and physical trauma. The circuit surface of silicon wafers is where the tapes market is directly supplied to a region. Wafers following back grinding tapes have likewise gotten progressively thinner, paralleling the trend of ever-thinner layers created on silicon wafers.

When the tapes are taken off, wafers may shatter if the adhesive force is too great. As a result, tapes must be simple to release. Fine imperfections can be found in silicon wafer-produced circuits. The grind water used to grind wafers can contaminate circuits if back grinding tapes do not follow these deviations and bubbles or gaps form. Furthermore, cracking and chipping of wafers during grinding may be made possible by the dimples that are created of the concentration of stress. Due to this, the market must have a high degree of followability in some region.

COVID-19 Impact: Industry Imbalance Causes Market Distortion

The development of the coronavirus has turned into a catastrophic problem for everyone. Production has stopped as a result of the worldwide lockdown scenario disrupting the supply chain for all electronic components. The COVID-19 epidemic has also made it more difficult to meet end-user demands  which is the virus's epicenter, produces the majority of electronic component goods.

The COVID-19 problem has caused a decline in the companies, stock market turbulence, and a significant slowdown in supply chain activities. The pandemic's overall effects are having an influence on several industries, including semiconductor and electronics manufacturing. Trade restrictions are further limiting the forecast for supply and demand. The government of many nations has already announced total lockout and temporary suspension of industries, which has a negative impact on the entire manufacturing process tapes eventually hindering the Back Grinding Tapes (BGT) market growth.

LATEST TRENDS

"Varieties in the Product to Boost the Market Growth "

In pharmaceutical, medical, forensic, and biological laboratories, surface and air disinfection treatment for micro-biological purity is crucial. For continuous procedures, which can eventually lead to the formation of these tapes, these facilities require the minimum necessary in isolation conditions. In addition to the industries, the hospitality industry is a significant one that is embracing back griding tapes (BGT) more frequently. It is frequently utilized in applications for the treatment of air, surfaces, and water, among numerous others. These new developments and varieties in product are mostly to increase the market's overall growth.

Back Grinding Tapes (BGT) Market SEGMENTATION

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• By Types 

Based on type, the market is classified into UV Type and Non-UV Type.

 In terms of product, UV type is the largest segment

• By Application

Based on application, the market is categorized Standard, Standard Thin Die, (S) DBG (GAL) and Bump.

In terms of application, standard is the largest segment. 

DRIVING FACTORS

"Uses of UV Gives the Market Extra Boost, Propelling the Market"

The global market is anticipated to develop over the course of the projected period as a result of rising social infrastructure expenditure. The usage of UV equipment has grown, and continuous efforts made by governments all over the world to build new water and wastewater treatment facilities. It is commonly applied at the second stage of the healing procedure. The back grinding tapes market (BGT) growth is anticipated to develop during the forecast period.

"Improved Efficacy to Accelerate Market Growth "

Over the forecast period, guidelines that offer improved safety measures are anticipated to fuel the growth of the market. UV technology is affordable, has improved efficacy, had a low running cost, and had little influence on the environment. This is due to the globally increasing competition among various industries in terms of making back grinding tapes with high consumer convenience, longer shelf life, and enhanced shelf appeal. The advancement of the product is helping the market to grow.

RESTRAINING FACTORS

"High Wafer Production Costs is Limiting Market Growth"

Compared to the other production system the wafer production is high in cost.  It is a very expensive process. Each new wafer product requires expensive design and manufacturing costs at some points. Additionally, its complexity, the cost of wafer is much higher. The overall cost of wafer production packaging is rising as a result of these obstacles. But as time goes on, this issue will be resolved in some way. If this problem is fixed, the market will start to grow right away.

Back Grinding Tapes (BGT) Market REGIONAL INSIGHTS

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"North America Dominating the Market across the Globe"

The market for back grinding tapes in North America has benefited from the region's expanding industrial development and several driving factors that have boosted the potential sectors because this region is the product's primary user. Due to investments in the relevant industry and technical improvements, the area is one of the contributors to the back grinding tapes market. The increased demand for smart technologies and gadgets has led to widespread acceptance and usage of semiconductor chips and ICs across North America. The consumer electronics, automotive electronics, industrial, healthcare industries rising product demand is the primary factor boosting the back grinding tapes (BGT) market share.  

KEY INDUSTRY PLAYERS

"Leading Manufacturers to Boost Product Demand"

The research provides details about the market on the participants and their activity in the sector. Acquisitions, mergers, technical advancements, collaborations, and increasing production facilities are used to gather and report the information. The companies that produce and introduce new products, the areas where they operate, automation, technology adoption, creating the greatest income, and making a difference with their products are some of the other factors that are looked at for this market.

List of Market Players Profiled

• Mitsui Chemicals Tohcello (Japan)
• Nitto (Japan)
• LINTEC (U.S.)
• Furukawa Electric (Japan)
• Denka (Japan)
• D&X (Japan)
• AI Technology (U.S.)

REPORT COVERAGE

The research goes into detail about market segmentation by type and application. The study examines a broad range of participants, including current and potential market leaders. A sizable market expansion is anticipated as a result of a number of important factors. The research also examines factors that may increase the advanced packaging inspection systems market share in order to provide market insights.

The report makes forecasts for market expansion over the anticipated time. The objective of the regional research is to explain why one region dominates the global market. A number of properly taken into account factors prevent the industry from growing. The research also includes a strategic analysis of the market. It includes thorough market information.