High Density Interconnect (HDI) PCBS Market Size, Share, Growth, and Industry Analysis, By Type (Single Panel, Double Panel and Other.), By Application (Automotive Electronics, Consumer Electronics and Other Electronic Products), Regional Insights, and Forecast To 2030

Updated On: 22 April 2024

High Density Interconnect (HDI) PCBS Market Report Overview

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The global high density interconnects (HDI) PCBs market size was USD 14700 million in 2022. As per our research, the market is expected to reach USD 26120 million by 2028, exhibiting a CAGR of 10.1% during the forecast period.

The global COVID-19 pandemic has been unprecedented and staggering, with the high density interconnect (HDI) PCBs market experiencing lower-than-anticipated demand across all regions compared to pre-pandemic levels. The sudden rise in CAGR is attributable to the market's growth and demand returning to pre-pandemic levels once the pandemic is over.

High-Density Interconnect (HDI) PCBs are printed circuit boards (PCBs) with a higher wiring density per unit area than traditional PCBs. This is achieved by using smaller traces, vias, and spaces, as well as by using blind and buried vias.

HDI PCBs are used in a variety of consumer electronics products, such as smartphones, laptops, and tablets. These products require high-speed data transmission and high-performance components, which can be accommodated by HDI PCBs.

COVID-19 Impact: Pandemic Decreased the Market Demand

The COVID-19 pandemic has had a significant impact on the high density interconnect (HDI) PCBs market share. The lockdown measures led to a decline in demand for consumer electronics products, such as smartphones, laptops, and tablets. This decline in demand led to a decline in demand for High density interconnect (HDI) PCBs, as these PCBs are used in many consumer electronics products. The lockdown measures led to a decline in demand for telecommunications services, such as mobile data and fixed-line broadband. This decline in demand led to a decline in demand for High density interconnect (HDI) PCBs, as these PCBs are used in many telecommunications products, such as routers, switches, and base stations. The lockdown measures led to a decline in demand for automotive products, such as cars, trucks, and buses. This decline in demand led to a decline in demand for High density interconnect (HDI) PCBs, as these PCBs are used in many automotive products, such as infotainment systems, engine control units, and airbag control units.

Latest Trends

"The adoption of low loss dielectric materials is expected to fuel the growth in the market"

High density interconnect (HDI) PCBs are used in applications that require high-speed data transmission, such as 5G, the Internet of Things (IoT), and artificial intelligence (AI). In these applications, it is important to minimize signal loss and ensure that signals are transmitted accurately. Low-loss dielectric materials help to improve signal integrity in HDI PCBs by reducing signal loss. Signal loss is caused by the dielectric constant of the PCB substrate. The dielectric constant is a measure of how much a material slows down the propagation of an electromagnetic field. A higher dielectric constant means that the signal will travel more slowly, and this can lead to signal loss. Low-loss dielectric materials have a lower dielectric constant than traditional PCB materials, such as FR4. This means that signals can travel faster through these materials, and this can help to reduce signal loss.

High Density Interconnect (HDI) PCBS Market Segmentation

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• By Type Analysis

According to type, the market can be segmented Single Panel, Double Panel and Other.

• By Application Analysis

Based on application, the market can be divided into Automotive Electronics, Consumer Electronics and Other Electronic Products.

Driving Factors

"The increasing demand for high-performance electronic devices to foster the market growth"

High density interconnect (HDI) PCBs are used in a variety of consumer electronics products, such as smartphones, laptops, and tablets. These products require high-speed data transmission and high-performance components, which can be accommodated by High density interconnect (HDI) PCBs. HDI PCBs are used in telecommunications products, such as routers, switches, and base stations. These products also require high-speed data transmission and high-performance components. HDI PCBs are used in automotive products, such as infotainment systems, engine control units, and airbag control units. These products are becoming increasingly complex and require high-speed data transmission. Consumers are demanding more and more features from their electronic devices. This is driving the demand for high-performance electronic devices, which require High density interconnect (HDI) PCBs.

"Growing adoption of new technologies, such as 5G and the Internet of Things (IoT) to result in the expansion of the market"

5G and the Internet of Things (IoT) are two new technologies that are driving the demand for High density interconnect (HDI) PCBs. 5G is the next generation of cellular network technology. It offers much faster data speeds than previous generations of cellular networks. This is driving the demand for HDI PCBs, which are needed to support the high data speeds of 5G. The IoT is a network of connected devices. These devices collect and exchange data over the internet. The IoT is growing rapidly, and this is driving the demand for HDI PCBs. HDI PCBs are needed to support the high data rates and complex signal routing requirements of IoT devices. In addition to 5G and the IoT, other new technologies, such as artificial intelligence (AI) and augmented reality (AR), are also driving the demand for HDI PCBs.

Restraining Factors

"The risk of signal integrity issues to hamper the market growth"

HDI PCBs are more susceptible to signal integrity issues than traditional PCBs. This is because the smaller traces and vias in HDI PCBs can cause signal reflections and crosstalk. Signal integrity issues can lead to performance problems in electronic devices.

High Density Interconnect (HDI) PCBS Market Regional Insights

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"Asia Pacific to lead the market owing to the growing demand for electronic devices. "

The Asia Pacific region has shown the highest high density interconnect (HDI) PCBs market  growth. The Asia-Pacific region is home to some of the world's largest economies, such as China, India, and Japan. These economies are driving the demand for electronic devices, which is in turn driving the demand for HDI PCBs.

Key Industry Players

"Key players are employing advanced technologies in order to stimulate further growth of the market.  "

All the major players are motivated to offer superior and more advanced services in order to gain a competitive edge in the market. To increase their market presence, vendors are using a variety of techniques, including product launches, regional growth, strategic alliances, partnerships, mergers, and acquisitions.

List of Market Players Profiled

• IBIDEN Group: Nagoya, Japan
• Unimicron: New Taipei City, Taiwan
• AT&S: Leoben, Austria
• SEMCO: Seoul, South Korea
• NCAB Group: Stockholm, Sweden
• Young Poong Group: Seoul, South Korea
• ZDT: Suzhou, China
• Compeq: Taipei, Taiwan
• Unitech Printed Circuit Board Corp.: Taoyuan, Taiwan
• LG Innotek: Seoul, South Korea
• Tripod Technology: Taoyuan, Taiwan
• TTM Technologies: Milpitas, California, USA
• Daeduck Electronics: Seoul, South Korea
• HannStar Board: Taoyuan, Taiwan
• Nan Ya PCB: Taipei, Taiwan
• CMK Corporation: Kyoto, Japan
• Kingboard: Shanghai, China
• Ellington: Suzhou, China
• CCTC: Shenzhen, China
• Wuzhu Technology: Dongguan, China
• Kinwong: Shenzhen, China
• Aoshikang: Dongguan, China
• Sierra Circuits: Fremont, California, USA
• Bittele Electronics: Taipei, Taiwan
• Epec: Fremont, California, USA
• Würth Elektronik: Neuhausen auf den Fildern, Germany
• NOD Electronics: Taipei, Taiwan
• San Francisco Circuits: San Francisco, California, USA
• PCBCart: Shenzhen, China
• Advanced Circuits: Milpitas, California, USA

Report Coverage

This report examines an understanding of the high density interconnect (HDI) PCBs market ’s size, share, growth rate, segmentation by type, application, key players, and previous and current market scenarios. The report also collects the market’s precise data and forecasts by market experts. Also, it describes the study of this industry’s financial performance, investments, growth, innovation marks, and new product launches by the top companies and offers deep insights into the current market structure, competitive analysis based on key players, key driving forces, and restraints that affect the demand for growth, opportunities, and risks.

Furthermore, the post-COVID-19 pandemic’s effects on international market restrictions and a deep understanding of how the industry will recover, and strategies are also stated in the report. The competitive landscape has also been examined in detail to provide clarification of the competitive landscape.

This report also discloses the research based on methodologies that define price trend analysis of target companies, collection of data, statistics, target competitors, import-export, information, and previous years’ records based on market sales. Moreover, all the significant factors which influence the market such as small or medium business industry, macro-economic indicators, value chain analysis, and demand-side dynamics, with all the major business players have been explained in detail. This analysis is subject to modification if the key players and feasible analysis of market dynamics change.