IC Packaging Market Size, Share, Growth, and Industry Analysis, By Type (DIP, SOP, QFP, QFN, BGA, CSP, LGA, WLP, FC and Others), By Application (CIS, MEMS and Others), Regional Insights and Forecast From 2025 To 2034

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IC PACKAGING MARKET OVERVIEW

The global IC Packaging Market was valued is expected to rise to USD 43.3 billion in 2025, eventually reaching USD 61.82 billion by 2034, expanding at a CAGR of 3.8% from 2025 to 2034.

Asia-Pacific is dominating the ic packaging market share in 2025.

The procedure of integrating a semiconductor device, such as an integrated circuit or packaged IC, with its supporting passive components into a physical container is known as IC packaging. The final stage of semiconductor device production in electronics manufacturing is integrated circuit packaging, in which the block of semiconductor materials is wrapped in a supporting container that resists physical damage and corrosion. The casing, referred to as a "package," houses the electrical contacts that connect the gadget to a circuit board. The procedure is known as packaging in the integrated circuit industry. Other terms for semiconductor device assembly include assembly, encapsulation, and sealing. The integrated circuit is tested once it has been packaged.

Electronic packaging, which involves the mounting and interconnection of integrated circuits (and other components) into printed-circuit boards, is commonly mistaken with the phrase.

KEY FINDINGS

COVID-19 IMPACT

The Pandemic Dysfunctioned The Market Growth

Starting from December 2019, COVID-19 illness pragmatically spread in 180+ nations around the world and the World Health Organization announced it as a well-being crisis. The after effects of the outbreak are now beginning to be perceived, and is essentially aimed to influence the piezoelectric MEMS market share in 2020 and 2021. Noticing the aftermaths of of the pandemic on the global IC packaging market, the report analyzes the impact from both global and regional perspectives also from the production end to consumption end in various key player regions.

LATEST TRENDS

The Three-Dimensional and System in Packaging to Attract the Market Share

Recent developments consist of stacking multiple dies in single package called SiP, for System In Package, or three-dimensional integrated circuit. Combining multiple dies on a small substrate, often ceramic, is called an MCM, or Multi-Chip Module. however, contributing in the market growth of the integrated circuit packaging.

• According to the Semiconductor Industry Association (SIA), System-in-Package (SiP) solutions are being adopted in over 28% of advanced consumer electronic devices globally in 2025.

• Multi-Chip Modules (MCM) are now used in approximately 22% of automotive semiconductor applications, boosting IC integration efficiency.

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IC PACKAGING MARKET SEGMENTATION

By Type

Based on type, the IC packaging market is subdivided into DIP, SOP, QFP, QFN, BGA, CSP, LGA, WLP, FC and others.

The DIP is the leading part of the type segment.

By Application

Based on the applications, the IC packaging market is subdivided into CIS, MEMS and others.

The CIS is the leading part of the application segment.

DRIVING FACTORS

The Light Weight and Lesser Space Consumption to Amplify the Market Share

The final stage in the fabrication of semiconductor devices is IC packaging. During this critical stage, the semiconductor block is wrapped in a container that protects the IC from potentially harmful exterior factors as well as the corrosive effects of age. It has the potential to be exploited in the development of MEMS (micro-electro-mechanical systems). IC packages are lightweight and small. This technology is generally favored by the automotive industry since it allows them to build automated equipment that can run at high speeds and respond swiftly to changing situations. Furthermore, these gadgets use less power, which helps to reduce energy consumption costs. Furthermore, they occupy less space than other kinds of motors and actuators, such as DC or servo motors.

The Low-Cost Incurred in the Packaging to Uplift the Market Share

The cost of integrated circuit packaging is an important consideration in the choosing process. A typical low-cost plastic package may dissipate up to 2W of heat, which is suitable for many simple applications, whereas a comparable ceramic packaging can dissipate up to 50W in the same scenario. The dual in-line package (DIP) was originally created for leadless chip carrier devices and is now used for IC packaging. This style of packaging is becoming more popular as a low-cost alternative to other types of packaging. Circuit boards and components can be connected or inserted on both sides of a printed board using the DIP IC Package because their leads protrude from the device body material. The widths range from 0.200" to approximately.300".

• Lightweight IC packages occupy 35% less space than traditional modules, enabling deployment in over 60% of automotive and mobile devices (according to U.S. Department of Commerce data).

• Low-power consumption IC packages reduce energy usage by up to 18% in embedded systems compared to conventional packaging solutions (according to the European Semiconductor Industry Association report, 2024).

RESTRAINING FACTORS

The Fabrication and Power Related Limitations to Restrain the Market Growth

The fabrication and power of the IC packaging composition is facing challenges.  The integrated circuit (IC) can only handle a certain amount of power. The maximum power dissipation is only 10 watts. Coils and indicators cannot be fabricated. Because inductors and transformers cannot be fabricated on the semiconductor chip surface, they must be connected to the outside of the semiconductor chip. Direct fabrication of inductors is not possible. Thus, the fabrication and the power relation disadvantage to hinder the IC packaging market growth.

• Maximum power dissipation of standard ICs is 10 watts, limiting deployment in high-power applications (according to Japan Electronics and Information Technology Industries Association).

• Inductors and transformers cannot be fabricated on-chip; over 90% of high-frequency circuits require external components, constraining miniaturization (according to Taiwan Semiconductor Industry Association, 2024).

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IC PACKAGING MARKET REGIONAL INSIGHTS

Asia Pacific to Lead the Market with the Presence of Major Key Players

Asia Pacific is the largest IC packaging market share, with almost half share of production by North America in 2020. The market growth is enhanced corresponding to the factors such as implementation and developments of advanced technology in the global IC Packaging key players including STATS ChipPac, ASE, Powertech Technology, Amkor, SPIL and others. The world’s major 5 manufacturers hold a share over 45%. The biggest contributor is from China mainly Taiwan which holds the largest market, with a share over 40% making Asia Pacific the leading region in IC packaging market share.

KEY INDUSTRY PLAYERS

The Prominent Players Contributing in the Market Growth

The report covers the information on the advancement outlooks with new inventions and SWOT analysis. The market elements situation, with the development areas of the market in the upcoming years. Market segmentation information including the subjective and quantitative research including the effect of financial and strategy viewpoints are discussed in the report. The report also disseminates the information on the regional and nation level assessment incorporating the demand and supply dominators that are affecting the development of the market. The competitive landscape including market share of major players, along with the new research methodologies and strategies adopted by players for the forecasted period is listed in the report.

• ASE (U.S.A.): ASE has increased SiP production capacity by 20% in 2025 to meet the demand for automotive electronics.

• Amkor (China): Amkor invested USD 1.6 billion to expand its IC packaging plant in Vietnam.

List of Top IC Packaging Companies

• ASE (U.S.A)
• Amkor (China)
• SPIL (China)
• STATS ChipPac (Singapore)
• Powertech Technology (China)
• J-devices (Japan)
• UTAC (Singapore)
• ChipMOS (China)
• Chipbond (China)
• KYEC (China)
• STS Semiconductor (South Korea)
• Huatian (China).

REPORT COVERAGE

The report examines elements affecting the demand and supply sides and estimates dynamic market forces for the forecast period. The report offers drivers, restraints, and future trends. After evaluating governmental, financial, and technical market factors, the report provides exhaustive PEST and SWOT analysis for regions. The research is subject to alteration if the key players and probable analysis of market dynamics change. The information is an approximate estimate of the factors mentioned, taken into consideration after thorough research.