Photoresist Ashing Equipment Market Size, Share, Growth, And Industry Analysis By Type (Wet Ashing, Plasma Dry Ashing) By Application (IC, Advanced Packaging, MEMS, LED, Others), Regional Insights and Forecast From 2025 To 2035

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PHOTORESIST ASHING EQUIPMENT MARKET OVERVIEW

The global photoresist ashing equipment market, valued at USD 0.19 billion in 2025, is forecasted to grow consistently, reaching USD 0.21 billion in 2026 and ultimately achieving USD 0.50 billion by 2035, at a steady CAGR of 10.45%.

Photoresist ashing equipment is a crucial component in the semiconductor manufacturing process and is used for the precise removal of photoresist material from semiconductor wafers. Photoresist is a light-sensitive material applied to wafers to create patterns during the photolithography process, an essential step in chip fabrication. After the desired patterns have been transferred onto the wafer, the photoresist must be removed to reveal the underlying layers. Photoresist ashing equipment accomplishes this by utilizing plasma technology. Typically, photoresist ashing equipment consists of a vacuum chamber where wafers are placed. Inside this chamber, a radiofrequency (RF) power source generates a low-pressure plasma environment. The plasma is usually a mixture of gases like oxygen or nitrogen, which chemically reacts with the photoresist material, breaking it down into volatile compounds that can be easily removed. The RF power source energizes the gas molecules, creating a highly reactive environment that efficiently removes the photoresist while minimizing damage to the underlying layers. Advanced ashing equipment also allows for precise control of process parameters, such as gas composition, pressure, and power, to ensure uniform and consistent results across wafers.

The Photoresist Ashing Equipment market has been witnessing steady growth in recent years. This growth can be attributed to the increasing demand for advanced semiconductor devices, which, in turn, drives the need for efficient photoresist ashing equipment. These machines play a crucial role in semiconductor manufacturing by removing the photoresist material, leaving behind intricate patterns and designs on the silicon wafer. As a result, the market has been expanding, albeit at a moderate pace.

KEY FINDINGS

COVID-19 IMPACT

Lockdown Drove the Need for Semiconductors Boosting the Market Growth

The COVID-19 pandemic has been unprecedented and staggering, with photoresist ashing equipment experiencing higher-than-anticipated demand across all regions compared to pre-pandemic levels. The sudden rise in CAGR is attributable to the market’s growth and demand returning to pre-pandemic levels.

The COVID-19 pandemic brought about disruptions in various industries, and the semiconductor sector was no exception. Initially, the pandemic led to supply chain disruptions, affecting the production of photoresist ashing equipment and semiconductor devices. However, the demand for electronic devices, particularly for remote work and entertainment purposes, surged during the pandemic, driving up the need for semiconductors and, consequently, photoresist ashing equipment. This demand surge helped the market recover relatively quickly from the initial setbacks caused by the pandemic.

LATEST TRENDS

Growing Adoption of Advanced Photoresists to Boost the Market Development.

One prominent trend in the Photoresist Ashing Equipment market is the growing adoption of advanced photoresist materials. As semiconductor devices become smaller and more complex, the need for finer patterning and higher precision in the manufacturing process has increased. This has led to the development and use of advanced photoresists that offer better etching and pattern transfer capabilities. In response, photoresist ashing equipment manufacturers are innovating to provide equipment that can handle these advanced materials effectively. This trend is expected to continue as semiconductor technology advances further.

• According to industry association estimates, more than 35 % of all photoresist ashing equipment installed in 2024 globally is now of the plasma dry-ashing type, reflecting a shift away from older wet ashing methods.

• According to government industry-survey data, the number of semiconductor fabrication lines deploying sub-3 nm lithography reached 42 units worldwide by end-2024, driving increased demand for advanced ashing equipment capable of handling ultra-thin resist layers.

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PHOTORESIST ASHING EQUIPMENT MARKET SEGMENTATION

By Type

According to type, the market can be segmented into Wet Ashing, Plasma Dry Ashing. Wet Ashing being the leading segment of the market by type analysis.

By Application

Based on application, the market can be divided into IC, Advanced Packaging, MEMS, LED, Others. IC being the leading segment of the market by application analysis.

DRIVING FACTORS

Semiconductor Industry Expansion to Drive the Market Growth

The expansion of the semiconductor industry is a major driver for the Photoresist Ashing Equipment market growth. Semiconductors are the building blocks of modern electronics, used in smartphones, computers, automotive electronics, and various other devices. As these industries grow and demand for smaller, more powerful, and energy-efficient chips increases, the need for advanced semiconductor manufacturing equipment like photoresist ashing machines also rises. This driver is expected to have a long-lasting impact on the market.

Research and Development in Nanotechnology to Drive the Market Development

Another significant driver for the market is the increasing focus on nanotechnology research and development. Nanotechnology has applications in a wide range of industries, including electronics, healthcare, and energy. Photoresist ashing equipment is essential in the fabrication of nanoscale structures and devices. As research in nanotechnology continues to expand, the demand for precise and reliable photoresist ashing equipment is expected to grow, driving market growth in this segment.

• According to national manufacturing statistics, the number of semiconductor units produced rose to 1.2 trillion units in 2024, necessitating higher throughput of post-lithography cleaning and ashing equipment.

• According to a trade-association report, over 60 % of new advanced packaging plants planned for build-out in Asia-Pacific over 2025-2028 will require specialized ashing equipment for system-in-package (SiP) and 3D IC modules, boosting demand for new installations.

RESTRAINING FACTORS

Technological Obsolescence to Impede the Market Growth

Manufacturers must continuously innovate to develop equipment that can handle the latest materials, finer patterns, and increased precision required by the semiconductor industry. This necessitates significant investments in research and development to stay competitive. Additionally, semiconductor manufacturers may be hesitant to invest in new equipment if they fear it will quickly become outdated, which can pose challenges for equipment manufacturers in terms of market adoption and sustainability. To address this challenge, companies in the Photoresist Ashing Equipment market must maintain a strong focus on research and development to ensure their products remain at the forefront of semiconductor manufacturing technology.

• According to government energy-usage data, photoresist ashing systems consume up to 250 kWh per hour of operation in high-volume fabs, which poses a cost challenge for manufacturers in regions with elevated power tariffs.

• According to industry association feedback, more than 45 % of existing fab-equipment for ashing still requires retrofit or replacement due to compatibility issues with new ultra-low-k and extreme ultraviolet (EUV) resists, creating a barrier to adoption of next-generation ashing tools.

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PHOTORESIST ASHING EQUIPMENT MARKET REGIONAL INSIGHTS

Asia Pacific to Bolster the Market due to the Presence of Major Semiconductor Manufacturing Hubs

Asia Pacific region in the Photoresist Ashing Equipment market share is underpinned by several key factors. Firstly, the presence of major semiconductor manufacturing hubs in countries like Taiwan, South Korea, and China cannot be overstated. These nations have established themselves as global leaders in semiconductor production, housing industry giants like TSMC, Samsung, and SMIC. These companies are responsible for a significant portion of the world's semiconductor output and rely heavily on advanced photoresist ashing equipment in their manufacturing processes. Furthermore, the competitive advantage of these countries goes beyond just the scale of semiconductor production. They have invested extensively in cutting-edge technologies, research and development, and infrastructure to maintain their position as leaders in the semiconductor industry. This commitment to technological advancement necessitates the use of the latest photoresist ashing equipment to meet the stringent demands of semiconductor fabrication. As a result, these nations represent a substantial portion of the market's revenue.

KEY INDUSTRY PLAYERS

Key Players Focus on Partnerships to Gain a Competitive Advantage

Prominent market players are making collaborative efforts by partnering with other companies to stay ahead of the competition. Many companies are also investing in new product launches to expand their product portfolio. Mergers and acquisitions are also among the key strategies used by players to expand their product portfolios.

• Trion Technology: According to industry licensing data, Trion Technology holds more than 120 patents globally related to plasma ashing apparatus upgrades for sub-10 nm process nodes, signalling strong R&D depth.

• TEL: According to equipment-shipment statistics, TEL delivered in excess of 450 units of its advanced ashing modules to major foundries in 2024, representing a significant proportion of new tool installations in that segment.

List of Top Photoresist Ashing Equipment Companies

• Trion Technology (U.S.)
• TEL (Japan)
• ESI (U.S.)
• Y.A.C. TECHNOLOGIES CO., LTD. (Taiwan)
• PIE Scientific (South Korea)
• PVA TePla (Germany)
• ULVAC (Japan)
• Lam Research (U.S.)
• SAMCO INC. (Japan)
• Diener electronic GmbH (Germany)
• Allwin21 Corp. (U.S.)

REPORT COVERAGE

This research profiles a report with extensive studies that take into description the firms that exist in the market affecting the forecasting period. With detailed studies done, it also offers a comprehensive analysis by inspecting the factors like segmentation, opportunities, industrial developments, trends, growth, size, share, and restraints. This analysis is subject to alteration if the key players and probable analysis of market dynamics change.