Semiconductor Molding Systems Market Size, Share, Growth, and Industry Analysis, By Type (Fully Automatic, Semi-automatic and Manual), By Application (Semiconductor Molding Systems, Wafer Level Packaging, BGA Packaging, Flat Panel Packaging and Others), Regional Insights and Forecast From 2025 To 2033

• 

  Request a Free sample to learn more about this report

SEMICONDUCTOR MOLDING SYSTEMS MARKET OVERVIEW

The global semiconductor molding systems market was valued at USD 0.49 billion in 2024 and is expected to grow to USD 0.54 billion in 2025, reaching USD 1.18 billion by 2033, with a projected CAGR of 10.2% from 2025 to 2033.

The moulding procedure in which resin encapsulation electrically isolates the semiconductor from the outside is referred to as "moulding." By infusing and curing fluid resin from the gate around the semiconductor chip, it shields it from damage. The term "automatic moulding machine" refers to a fully automatic semiconductor packaging process device that transfers the lead frame automatically from the feeding box for plastic sealing, then moves it to the discharge box after removing any remaining glue.

Industrial plastics and polymers that are appropriate for forming include moulding compounds and resins. They are utilised in blow moulding, resin transfer moulding, reaction injection moulding, compression moulding, and injection moulding. The fine-filled, electrically stable compounds used in semiconductor moulding compounds are perfect for the demands of miniaturised semiconductor packing. They can be electrically stable at high temperatures and have tiny filler sizes and excellent spiral flow. In general, phenol and formaldehyde are combined with a filler substance to create plastic moulding compounds. The two main categories of moulding compounds that are frequently utilised to create plastic materials are thermosetting.

COVID-19 IMPACT

Low Demand During the Pandemic to Impede Market Expansion

Semiconductor businesses acted swiftly to protect workers, secure supply chains, and take care of other urgent issues in the months following the coronavirus's outbreak. Leaders in the semiconductor industry are now anticipating the time when the pandemic subsides and the new normal sets in, despite the fact that the situation is still critical and numerous countries are still enforcing physical-distancing standards. The company is considering tactics for rethinking and transforming their business models—two actions that McKinsey defined in a framework for responding to the coronavirus—to get ready for that moment. Due to COVID-19, the semiconductor and electronics sector has already seen significant losses during the first quarter of the epidemic.

 However, the sector is committed to making a strong comeback, and in the second half of this year, average industrial growth is anticipated. In all component segments, there is a significant trend toward "no impact" and "little impact," and the supply chain is not anticipated to be disrupted. The demand for electronics components is also slowing down, which relieves strain on the supply chain while the industry struggles to maintain a balance between supply and demand. Leading companies in this sector are paying closer attention to their delivery and production plans.

LATEST TRENDS

Durability of the Equipment to Promote Market Growth

Systems for moulding semiconductors provide increased stiffness and excellent stress-resistant qualities. They have thus evolved into crucial elements in the manufacture of bottles. In addition, they provide other qualities including high load melt strength and scratch resistance.

Request a Free sample to learn more about this report

SEMICONDUCTOR MOLDING SYSTEMS MARKET SEGMENTATION

By Type

Based on type; the market is divided into fully automatic, semi-automatic and manual.

In terms of product, fully automatic is the largest segment.

By Application

Based on application; the market is divided into semiconductor molding systems, wafer level packaging, BGA packaging, flat panel packaging and others.

In terms of application, BGA packaging is the largest segment.

DRIVING FACTORS

Expansion in E-Commerce Industry to Augment Market’s Growth

The packaging of personal care items, medical equipment, and household chemicals has extensively used semiconductor molding. In the years to come, it is anticipated that additional factors such as reduced installation costs, improved operational efficiency onshore, and expansion in the e-commerce industry would further aid in the market's expansion. In the next years, it is also projected that the ease with which semiconductor moulding systems made of polyvinyl chloride and polyethylene may be processed would increase product demand and strengthen the market as a whole. Due to rising consumer demand for products including shampoo bottles, motor oil bottles, cooler bottles, and industrial drums, polyethylene blow moulding resins are anticipated to contribute the most to the total semiconductor molding systems market growth.

Excellent Graphics of the Equipment to Propel Market Growth

Prior to building the equipment, the proper materials are selected to guard against weather-related attacks and fires. As a result, manufacturers have recently produced equipment with incredible attention to detail. The graphics, threads, small undercuts, and handles on objects made using semiconductor molding systems machines are also abundant. These machines can also be used to refine flat surfaces. As a result, it is anticipated that semiconductor molding systems market would see increased use in the production sector in the next years.

RESTRAINING FACTORS

COVID-19 Impact on the Market to Hamper Growth

The COVID-19 epidemic had a detrimental effect on the market for semiconductor moulding systems as a whole. Manufacturing facilities were compelled to shut down temporarily or permanently as a result of governments enforcing lockdowns and stringent social distancing laws in an effort to stop the virus' spread. As a result, the demand for blow moulding semiconductors decreased, which had an effect on the market for these equipments globally.

• Request a Free sample to learn more about this report

•  

SEMICONDUCTOR MOLDING SYSTEMS MARKET REGIONAL INSIGHTS

Asia Pacific to Dominate the Market Due to Demand for Anti-Aging Goods

Asia Pacific to dominate the market and owns largest portion of semiconductor molding systems market share. Due to rising demand for skin care products among various population segments worldwide, Asia Pacific is anticipated to overtake all other regions as the market's dominating region in the coming years. Due to the presence of numerous influential industry players, Asia Pacific is predicted to present profitable growth prospects for the market in the years to come. The demand for anti-aging goods in countries is predicted to increase, which will lead to significant growth in the Asia Pacific region. Due to the lack of well-established market participants in the region's member states, the blow moulding resins market in the region is predicted to grow moderately in the future years.

KEY INDUSTRY PLAYERS

Entry of New Market Players to Boost Market Growth

The top manufacturers of semiconductor molding systems are concentrating on showcasing the value of their goods to underserved markets. Numerous new industries have embraced plastic manufacturing, opening up fresh growth opportunities for market vendors. To catch the eye of potential customers in the market, these suppliers are also promoting casting of metals and steel. Ferry Industries Inc. and Rotomachinery Group are two of the top companies active in the global semiconductor molding systems market. This Advanced research offers a thorough analysis of the market, including development patterns, planned aspects, expanding prospects, risks/challenges, and landscape investigation. It also addresses the factors that have led to new market entrants in light of the adjustments made in this industry. The above data points provided are only related to the companies' focus related to the market.

List of Top Semiconductor Molding Systems Companies

• TOWA (Japan)
• ASMPT (Singapore)
• Besi (Netherlands)
• I-PEX (Japan)
• Yamada (Japan)
• TAKARA TOOL & DIE (Japan)
• Asahi Engineering (Japan)
• Tongling Fushi Sanjia (China)
• Nextool Technology (China)
• DAHUA Technology (China)

REPORT COVERAGE

The market research report on semiconductor molding systems offers insights and analysis into the crucial elements that will rule during the projected period and their effects on market growth. The study offers important data on the market situation for producers of commodity chemicals and is a useful resource for businesses and anyone interested in the sector. The research starts out by giving a fundamental review of the sector, including its definition, uses, and manufacturing methods. The paper then goes into great detail about the top global industry participants. The research includes each firm's market share and company profile in this section.