Thermo Compression Bonder Market Size, Share, Growth, and Industry Analysis, By Type (Automatic Thermo Compression Bonder & Manual Thermo Compression Bonder), By Application (IDMs & OSAT), Regional Insights, and Forecast To 2031

Updated On: 08 April 2024

Thermo Compression Bonder Market Report Overview

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The global thermo compression bonder market size was USD 71 million in 2021 and is expected to reach USD 512.63 million in 2031, exhibiting a CAGR of 21.8% during the forecast period.

Thermo compression bonder, also known as diffusion bonding, pressure joining, thermo compression welding, or solid-state welding, is a wafer connecting process. A piece of machinery called a thermo compression uses pressure and vacuum to adhere or weld a semiconductor wafer together. Based on the vibration of the crystal lattice, the atoms move from one to the other. The interface is held together by this atomic contact. The three names for the diffusion processes are surface diffusion, grain boundary diffusion, and bulk diffusion.

The fundamental idea behind this technique is the application of quick cooling after a rapid temperature rise, which implies high-speed processing with extremely tight tolerances. Additionally, these devices are available in semiautomatic and fully automatic configurations. Due to the lack of human processes or specialized equipment, it offers the same functionality as wire bonding with a significantly higher throughput.

COVID-19 Impact: Instability of Product Causes Market Distortion

The global COVID-19 pandemic has been unprecedented and staggering, with thermo compression bonder industry experiencing higher-than-anticipated demand across all regions compared to pre-pandemic levels. The sudden rise in CAGR is attributable to the thermo compression bonder market growth and demand returning to pre-pandemic levels once the pandemic is over.

For machinery companies, the COVID-19 outbreak resulted in issues such as unstable markets, a decline in client confidence, and disruptions in import and export activities. The global supply chain includes the sourcing of raw materials, packaging, and distribution. Transporting supplies, equipment, and advance materials had been challenging due to lockdowns. In addition, it had a financial influence on the markets for equipment as well as a direct impact on markets and supply chains, supply and demand, and all of these things. Machinery & equipment manufacturers are focusing on protecting their workforce, operations, and supply chains to respond toward this immediate crisis. The pandemic impacted the industry dynamics, forcing organizations to revamp their entire operation structures to maintain stability amid the disruptions. Aside from that, the companies' business operations have been affected by the outbreak, which has an effect on the overall thermo compression industry. This has partially impacted the thermo compression bonder market.

LATEST TRENDS

"Semiconductor Fabrication to Boost the Market Growth"

The Growing demand from a variety of end-user sectors, including semiconductors, flat panel displays (FPD), solar photovoltaic (PV) cell, and packaging substrate segments, is one of the key trend elements causing this expansion. The outsourcing of the semiconductor manufacturing process is becoming more and more popular, which boosts demand for thermal compression. The primary trends that are assisting the market and functioning as a step to accelerate market growth are the growing requirement for automation in manufacturing processes, the popularity of automated equipment, and rising government backing for the expansion of production capacity. Traditional producers are under more pressure than ever to adopt cutting-edge technologies and restructure their operations and organizational structures due to increased demand and competitive pressure. Additionally, the main trend boosting goods sales is the industry.

Thermo Compression Bonder Market Segmentation

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• By Types 

Based on type, the market is classified into Automatic Thermo Compression Bonder & Manual Thermo Compression Bonder.

• By Application

Based on application, the market is categorized into IDMs & OSAT.

DRIVING FACTORS

"Integrated Devices Gives the Market Extra Boost "

For the mass production of electronic goods, integrated device manufacturers (IDMs) frequently use thermo compression bonder. They benefit from economies of scale to reduce costs while keeping performance and security at a high level. The controller of the thermo compression in IDMs is in charge of modernization. In order to deliver high-quality solutions, the pool of readily available highly experienced individuals must be prepared to work on next-generation goods as standards change. As a result, the growth, IDMs and advancement in the industry will contribute to the expansion of the thermo compression industry and it will improve the overall thermo compression bonder market growth.

"Outsourced Semiconductor to Accelerate Market Growth"

Due to the accuracy and compactness of these equipment, thermo compression is employed in outsourced semiconductor manufacturing and testing. These systems are perfect for mass producing high-speed components like LEDs because they have rapid cycle durations, which are important for the bottom line. They also have the option to use high-speed pick and place machines, which is very advantageous for accurate component placement. More wafers can be produced per hour and cycle times can be shortened as a result. Thermo compression can also be coupled with automated optical inspection systems. With all these different functions and thermal compression, the industry will expand at a profitable pace thanks to new developments in invention, development, and multitasking. The attributes of this product are what are propelling market expansion.

RESTRAINING FACTORS

"Product's life Cycle Restricting Market Expansion"

Machinery systems are challenging to handle and maintain since they often have a short lifespan, high power needs, and intricate system designs. Electronic systems require complicated software algorithms, which inevitably results in high battery utilization. The growth of the market is hampered by these factors. But because these technologies greatly increase a product's complexity, it is challenging for the product's makers to handle the resulting safety and reliability issues. Sales and reliability are anticipated to constrain the industry, but if there are less restrictive factors and this problem is overcome, the market will immediately start to expand.

Thermo Compression Bonder Market Regional Insights

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"North America Dominating the Market Across the Globe"

The region's growing industrial development, which has expanded the possibility of sectors as this region is the greatest user of the product, have assisted the growth of the thermo compression bonder market in the North America. The key factor driving the growth of the thermo compression bonder market share is that investment of government on machinery sector, increase in the production of the product and adopting technological developments will further boost the overall market.

KEY INDUSTRY PLAYERS

"Leading Manufacturers to Boost Product Demand"

The research provides details on the list of market participants and their activity in the sector. Acquisitions, mergers, technical advancements, collaborations, and increasing production facilities are used to gather and report the information. The companies that produce and introduce new products, the areas where they operate, automation, technology adoption, creating the greatest income, and making a difference with their products are some of the other factors that are looked at for this market.

List of Market Players Profiled

•  K&S (Singapore)

•  Besi (Netherland)

•  Shibaura (Japan)

• Hanmi (South Korea)

• SET (U.S.)

REPORT COVERAGE

The report looks at all facets of the market, including type and application market segmentation. The study looks at a wide range of participants, including present and future market leaders. A considerable market expansion is anticipated to be fueled by a number of important factors. The research also includes factors that are probably to increase thermo compression bonder market share in order to provide market insights. Additionally, the research includes projections for market expansion throughout the predicted period. The objective of the regional analysis is to clarify why one region dominates the worldwide market. The market can't grow because of a number of issues, all of which have been properly considered. Moreover, a market strategic analysis is included in the report. It contains comprehensive market data.