Thinning Machine Market Size, Share, Growth, and Industry Analysis, By Type (Fully Automatic and Semi-automatic), By Application (200mm Wafer and 300mm Wafer), Regional Insights, and Forecast From 2024 To 2032

Updated On: 22 April 2024

Thinning Machine Market Report Overview

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The global thinning machine market size was USD 902.3 million in 2022. As per our research, the market is expected to reach USD 1194.6 million in 2029, exhibiting a CAGR of 6.5% during the forecast period.

The global COVID-19 pandemic has been unprecedented and staggering, with the thinning machine market experiencing lower-than-anticipated demand across all regions compared to pre-pandemic levels. The sudden rise in CAGR is attributable to the market's growth and demand returning to pre-pandemic levels once the pandemic is over.

The thinning machine serves a crucial role in the wafer surface processing of material segments, a critical step before integrated circuit packaging. Its primary function is to grind and remove the substrate material from the back of the wafer, achieving the desired chip package thickness and surface smoothness. Additionally, this process enhances the chip's heat dissipation efficiency. Thinning the wafer to the appropriate thickness is vital as it greatly facilitates the subsequent packaging process.

The market is anticipated to witness a steady growth rate during the projection period due to the growth of the semiconductor industry, technological advancements, demand for integrated circuits and electronic devices, and the need for improved heat dissipation in electronic components. Furthermore, the market is fragmented by type and by application. On the basis of type, fully automatic and semi-automatic machines are available in the market. While 200mm wafers and 300mm wafers are the key applications in the market which create the demand for the machine and aid the market growth with an excellent CAGR over the forecast 2022-2028.

COVID-19 Impact: Pandemic Reduced the Demand for the Machine due to Financial Constraints

The global economy experienced adverse effects during the coronavirus outbreak in 2020-21. Governments around the world-imposed restrictions, and not only social activities but also industrial operation was halted due to COVID-19. Besides, the pandemic disrupted the supply chain and shut downed factories led to delays in production and delivery of thinning machines. While fluctuations in demand affected the semiconductor industry's need for this equipment. Financial constraints were another factor that influenced purchasing decisions, and remote work posed challenges for equipment installations and support services. However, the market showed signs of recovery as lockdowns eased, and digitalization trends accelerated the demand for the machines.

Latest Trends

"Trend of Thinning on Advanced Materials Magnify the Market Outlook"

The market is anticipated to grow exponentially due to key driving factors and advancements in technology such as AI and ML, which contribute to expanding market dynamics. However, ongoing trends and expansion the application industry is also one of the main factors to boost market potential. This resulted in, thinning machines becoming more automated with robotics, AI, and machine learning technologies. Furthermore, with the emergence of new materials in semiconductor manufacturing, such as gallium nitride (GaN) and silicon carbide (SiC), thinning machines are being adapted to handle these materials, which have different properties and challenges compared to traditional silicon wafers. Thereby, the market is projected to accelerate the growth of the market with such emerging trends and developments.

Thinning Machine Market Segmentation

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• By Type Analysis

According to type, the market can be bifurcated into Fully Automatic and Semi-automatic.

• By Application Analysis

Based on application, the market can be divided into 200mm Wafer and 300mm Wafer.

Driving Factors

"Rising Semiconductor Industry Uplift the Demand for the Machine"

The semiconductor industry is one of the crucial applications for thinning machines and the continuous expansion of this industry, is driven by increasing demand for electronic devices in various sectors, including consumer electronics, automotive, industrial automation, and telecommunications. As the semiconductor market grows, the need for thinning machines to prepare wafers for chip packaging increases. Thus, the factor is attributed to augmenting the thinning machine market growth throughout this projection timeframe. 

"Growing Advancements in Technology Elevate the Growth of the Market"

Constantly rising technological advancements in semiconductor manufacturing processes and equipment play a crucial role in driving the demand for more sophisticated thinning machines. Manufacturers are constantly seeking ways to produce smaller, more powerful, and energy-efficient chips, requiring precise and efficient thinning processes which is likely to contribute to fuel the demand for the machine in the coming years.

Restraining Factors

"High Initial Investment Can Confine the Market Extension"

Thinning machines are sophisticated and specialized equipment used in semiconductor manufacturing, and they can be expensive to acquire and install. The high initial investment cost may deter some manufacturers from adopting thinning machines, especially for smaller or less-established companies. As a result, these factors can hinder the potential growth of the market.

Thinning Machine Market Regional Insights

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"Asia Pacific Dominates the Market Due to Strong Semiconductor Industry and High Demand for Electronics"

As per previous years’ records, the leading region in the market is Asia-Pacific, driven by the dominance of the semiconductor industry in countries such as Japan, and China. These countries are hubs of major semiconductor manufacturers and are at the forefront of technological advancements in chip manufacturing. The high production volume, government support, and rising demand for electronics in the region contribute to the strong demand for thinning machines for semiconductor wafer processing. Additionally, in terms of global market share, more than half of the thinning machine market shares are owned by Japan and China.

Key Industry Players

"Key Players Offer Cutting-Edge Solutions to Meet the Evolving Demands of the Electronics"

With regard to key players, Prominent companies in the market strive to maintain their position through continuous innovation, ensuring high product quality and performance. They prioritize customer support and service, leveraging a global reach and strong sales network. Furthermore, forming strategic industry partnerships and offering customizable solutions further enhances their competitiveness. Adherence to industry standards and regulations, along with a focus on continuous improvement and lean manufacturing, allows them to optimize operations and build a trusted brand reputation. Moreover, the top three companies dominate the market with their highest profit revenue.

List of Market Players Profiled

• Disco
• Tokyo Precision
• G&N
• Okamoto Semiconductor Equipment Division
• Beijing CETC
• Koyo Machinery
• Revasum
• WAIDA MFG
• Hunan Yujing Machinery
• SpeedFam
• Huahai Qingke

Report Coverage

This report defines the thinning machine market. It emphasizes the market value, expected CAGR, and USD value over the forecast period, before and after the impact of the COVID-19 pandemic restrictions on the international market, and how the industry is going to turn the corner is also stated in the report. The report provides significant market data with its product type and product applications, end-use details, and an idea of the market growth in the future. This report also provides an understanding of the growing market trends and developments and their effects on the market growth, driving factors along with restraining factors that impact the market dynamics. Along with this, the leading region, key players of the market, and their tactics to beat the market competition, sustainable policies, their collaboration, mergers, companies’ profile, previous years’ revenue, profit & loss, and market position based on their share value in the market, are also explained in the report.