Through Glass Via (TGV) Substrate Market Size, Share, Growth, and Industry Analysis, By Type (300 mm, 200 mm, Below 150 mm) By Application (Biotechnology/Medical, Consumer Electronics, Automotive, Others) Regional Forecast From 2025 To 2034

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THROUGH GLASS VIA (TGV) SUBSTRATE MARKET OVERVIEW

The global Through Glass Via (TGV) Substrate Market size stood at USD 0.12 billion in 2025, growing further to USD 0.88 billion by 2034 at an estimated CAGR of 25.17% from 2025 to 2034.

The United States Through Glass Via (TGV) Substrate Market size is projected at USD 0.03721 billion in 2025, the Europe Through Glass Via (TGV) Substrate Market size is projected at USD 0.02955 billion in 2025, and the China Through Glass Via (TGV) Substrate Market size is projected at USD 0.03319 billion in 2025.

The global COVID-19 pandemic has been unprecedented and staggering, with the through glass via (TGV) substrate market experiencing lower-than-anticipated demand across all regions compared to pre-pandemic levels. The sudden rise in CAGR is attributable to the market's growth and demand returning to pre-pandemic levels once the pandemic is over.

Through glass via (TGV) substrate is a technology used in the manufacturing of microelectromechanical systems (MEMS) and other electronic devices. TGV substrates are made of glass and feature small, cylindrical holes or vias that pass through the entire thickness of the substrate. These vias are typically filled with a conductive material, such as metal, to create electrical connections between different layers or components on the substrate.

TGV substrates find applications in a wide range of industries, including telecommunications, automotive, aerospace, medical devices, and consumer electronics. They are used in devices such as RF filters, sensors, microfluidic systems, pressure sensors, accelerometers, and more. The unique properties of TGV substrates make them an attractive choice for applications that require high reliability, miniaturization, and performance in harsh environments.

KEY FINDINGS

COVID-19 IMPACT

Pandemic Decreased the Market Demand

There have been some positive impacts of COVID-19 on the through glass via (TGV) substrate market share. The pandemic led to disruptions in global supply chains, including the semiconductor industry. Manufacturing facilities and logistics were affected due to lockdown measures, travel restrictions, and workforce limitations. These disruptions could have impacted the production and availability of through glass via (TGV) substrate, potentially leading to delays in projects and orders. The pandemic caused economic uncertainties and reduced consumer spending in various sectors. As a result, the demand for certain electronic devices and applications that utilize TGV substrates, such as smartphones, automotive electronics, and consumer electronics, may have experienced a temporary slowdown. This has impacted the demand for through glass via (TGV) substrate in the market.

LATEST TRENDS

Miniaturization and integration to fuel the growth in the market

The trend of miniaturization and integration in the electronics industry is driving the demand for smaller and more compact devices. This trend is fuelled by factors like portability, wearable technology, and the need for space-saving solutions. Through Glass Via (TGV) substrates play a crucial role in this trend by enabling the creation of high-density interconnections in compact form factors. TGV substrates allow for the integration of complex circuitry and components in a smaller footprint, facilitating the development of miniaturized electronic devices. This trend is especially relevant in industries such as consumer electronics, mobile devices, IoT, and medical devices, where size and portability are key considerations.

• 300-mm dominance: The 300-mm wafer segment represented about 60.1% of wafer-size share in glass interposers (2024), underscoring migration to larger wafers for TGV production.

• Smaller TGVs enabled: Vendors report TGV hole diameters down to 100 µm (Plan Optik) and thin-glass handling down to ≤35 µm via patterns in specialist handling offerings, enabling finer pitch .

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THROUGH GLASS VIA (TGV) SUBSTRATE MARKET SEGMENTATION

By Type Analysis

According to type, the market can be segmented 300 mm, 200 mm, below 150 mm.

By Application Analysis

Based on application, the market can be divided into biotechnology/medical, consumer electronics, automotive and others.

DRIVING FACTORS

High-frequency and RF applications to foster the market growth

The increasing deployment of high-frequency and RF technologies such as 5G, IoT, and wireless communication systems has created a demand for substrates that can deliver excellent signal integrity. TGV substrates are well-suited for high-frequency and RF applications due to their low signal losses, low parasitic capacitance, and high electrical isolation. These properties enable efficient signal transmission and minimize interference, ensuring the integrity of high-frequency signals. TGV substrates find applications in RF filters, antenna modules, RF switches, and other components where reliable high-frequency performance is essential. As the demand for high-speed wireless communication and connectivity continues to grow, TGV substrates play a crucial role in enabling the development of advanced RF systems.

Reliability and hermeticity to result in the expansion of the market

In industries such as aerospace, defence, and medical devices, reliability and hermeticity are of utmost importance. TGV substrates offer high reliability due to the use of glass as the substrate material, which provides stability and resistance to environmental factors. Additionally, the vias in TGV substrates can be filled with a glass frit or other suitable sealing material, creating a hermetic seal that protects sensitive components from moisture, gases, and contaminants. This hermeticity ensures the long-term performance and reliability of electronic devices in challenging environments. TGV substrates are thus favored in applications where protection against harsh conditions, such as high humidity or temperature fluctuations, is critical, making them suitable for aerospace electronics, implantable medical devices, and other demanding applications.

• Regional demand concentration: Asia-Pacific accounted for ~52.3% of the glass interposers market in 2024, supplying the lion’s share of TGV demand.

• Public funding to scale glass supply: The U.S. CHIPS Incentives Program finalized up to $32M award for Corning to expand semiconductor-grade glass capacity — a concrete supply-chain stimulus for TGV substrates.

RESTRAINING FACTORS

Cost considerations to hamper the market growth

TGV substrates, particularly those with advanced features and high-density interconnections, can involve complex manufacturing processes and specialized equipment. This can result in higher production costs compared to traditional substrate materials. Cost considerations may limit the adoption of TGV substrates, particularly in price-sensitive markets or applications where cost efficiency is a primary concern.

• Manufacturing tolerances: Standard TGV minimum via diameters and tolerances (e.g., Tecnisco lists min via diameter 0.15 mm (150 µm), max aspect ratio up to 1:5) indicate tight process windows for high-density interposers.

• High aspect-ratio fill challenges: Industry technical work flags plating/fill challenges for aspect ratios >3, making fully-filled high-AR vias more difficult and limiting some design choices.

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THROUGH GLASS VIA (TGV) SUBSTRATE MARKET REGIONAL INSIGHTS

Asia-Pacific to lead the market owing to increasing demand for TGV substrates in the electronics and automotive industries. 

Asia Pacific region has shown the highest through glass via (TGV) substrate market growth. This is due to the increasing demand for TGV substrates in the electronics and automotive industries. The electronics industry is the largest end-user of TGV substrates, and the demand for TGV substrates in this industry is expected to grow due to the increasing demand for electronic devices such as smartphones, tablets, and laptops. The automotive industry is also a major end-user of TGV substrates, and the demand for TGV substrates in this industry is expected to grow due to the increasing demand for electric vehicles.

KEY INDUSTRY PLAYERS

Key players are employing advanced technologies in order to stimulate further growth of the market.

All the major players are motivated to offer superior and more advanced services in order to gain a competitive edge in the market. To increase their market presence, vendors are using a variety of techniques, including product launches, regional growth, strategic alliances, partnerships, mergers, and acquisitions.

• Plan Optik: Offers drilled glass interposer wafers up to 300 mm diameter with hole diameters down to 100 µm .

• Tecnisco: Publishes standard TGV specs supporting wafers up to φ200 mm, min via diameter 0.15 mm (150 µm) and max aspect ratio 1:5 (He-leak hermeticity specs listed).

List of Top Through Glass Via (TGV) Substrate Companies

• Plan Optik
• Tecnisco
• LPKF
• Allvia
• Microplex
• Corning
• Samtec
• Kiso Micro Co.LTD
• NSG Group

REPORT COVERAGE

This report examines an understanding of the through glass via (TGV) substrate market’s size, share, growth rate, segmentation by type, application, key players, and previous and current market scenarios. The report also collects the market’s precise data and forecasts by market experts. Also, it describes the study of this industry’s financial performance, investments, growth, innovation marks, and new product launches by the top companies and offers deep insights into the current market structure, competitive analysis based on key players, key driving forces, and restraints that affect the demand for growth, opportunities, and risks.

Furthermore, the post-COVID-19 pandemic’s effects on international market restrictions and a deep understanding of how the industry will recover, and strategies are also stated in the report. The competitive landscape has also been examined in detail to provide clarification of the competitive landscape.

This report also discloses the research based on methodologies that define price trend analysis of target companies, collection of data, statistics, target competitors, import-export, information, and previous years’ records based on market sales. Moreover, all the significant factors which influence the market such as small or medium business industry, macro-economic indicators, value chain analysis, and demand-side dynamics, with all the major business players have been explained in detail. This analysis is subject to modification if the key players and feasible analysis of market dynamics change.