Wafer Stripper Market Size, Share, Growth, and Industry Analysis, By Type (Wet Stripper, Dry Stripper and Others), By Application (LED Chip Manufacturing, MEMS Chip Manufacturing, Communication Chip Manufacturing and Others), Regional Forecast To 2031

Updated On: 15 April 2024

Wafer Stripper Market REPORT OVERVIEW

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The global wafer stripper market size is expanded rapidly in 2022 and market is expected to generate substantial revenue by 2031, exhibiting a high compound annual growth rate (CAGR) from 2022 to 2031.

To make sure that a semiconductor wafer is always clear of impurities and foreign elements as it goes through the wafer fabrication process, a number of wafer cleaning procedures or stages are used. Various contaminants have distinct properties, and as a result, need to be removed off the wafer in different ways. Between production phases, strip and clean techniques are utilised to remove extraneous material that can subsequently cause problems and to ready the wafer surface for further processing. Wafer stripper process cleans up the leftovers from ion implant or etch stages. Wafer cleaning processes are incorporated into the production process to remove particles, impurities, residues, and other undesired elements. Technologies for wet processing can be applied to strip and etch tasks as well as wafer cleaning.

COVID-19 Impact: The COVID-19 Underlying Condition Downgraded the Market Growth

We can all see how the COVID-19 epidemic has caused a huge number of unexpected and important changes in every industry, and how the market has suffered as a result of lockdown measures taken in many countries. Obstacles have been established in the midst of the pandemic due to production limitations and transportation-related delays. The treatment of various illnesses was either slowed down or disrupted by the subsequent waves of new coronavirus, which dramatically hampered the wafer stripper market share.

LATEST TRENDS

"Automation and the Human Safety in the Manufacturing to Boost Up the Market Growth. "

By automating wafer stripper, removing wafer surface damage that was occurring at the time of wafer stripping, and additionally lowering wafer breakage, it is possible to reduce the cost of a device by increasing labour efficiency and yield rates. Regarding the question of worker safety in the industrial setting, the majority of single wafer strip chambers have a face-up architecture that by nature exposes the surroundings to solvent fumes, albeit a box or enclosure may be added so that the surrounding area of the chamber can be vented. Inevitably, this takes up tool space. When the chamber is opened, it is always devoid of any solvent, which is how face-down chambers function similarly to batch spray systems.

Wafer Stripper Market SEGMENTATION

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• By Type

Based on type the wafer stripper market is classified as wet stripper, dry stripper and others.

The type wet stripper is the leading part of the type segment.

• By Application

Based on application the wafer stripper market is classified as LED chip manufacturing, MEMS chip manufacturing, communication chip manufacturing and others.

The LED chip manufacturing type is the leading part of the application segment.

DRIVING FACTORS

"The Wet Inorganic and Dry Stripping Advantageous Process to Decipher the Market Share"

Dry stripping refers to the process of dry etching with plasma etching equipment in order to remove photoresist. Better safety, the absence of metal ion contamination, less environmental concerns, and a reduced propensity to adhere underlying substrate layers are some of its advantages versus wet etching with organic or inorganic strippers.

Wet inorganic wafer strippers, often referred to as oxidizing-type strippers, are used for inorganic stripping, typically to remove post-baked and other difficult-to-remove resists, as well as photoresist from non-metallized wafers. Solutions of sulfuric acid plus an oxidant (such ammonium persulfate), heated to around 125 degrees Celsius, are used as inorganic strippers.

"The Silicon Nitride Strip Process to Effectively Inflate Market Share"

By using a hot acid bath and a silicon nitride strip method, silicon nitride can be successfully removed from silicon wafer surfaces. The selectivity of the bath strip solution and the repeatability of the process variables are the key ingredients for producing high-quality outcomes. High selectivity is necessary to remove silicon nitride while leaving silicon oxide in situ, and the process must reliably produce the same outputs from the same inputs. By introducing DI water to keep the acid to water ratio constant, the Nb series silicon nitride etch bath helps this process by monitoring bath temperature. The procedure can be precisely managed to produce outstanding consistency, resulting in the desired selectivity and the needed repeatability.

RESTRAINING FACTORS

"The Disadvantage Associated with the Higher Cost of the Wafer to Pose Challenges In Market Growth"

The cost of 450 mm fabs rises due to higher-priced semiconductor fabrication equipment for larger wafers (semiconductor fabrication facilities or factories). Because lithography accounts for more than half of total wafer processing expenses, lithographer Chris Mack claimed in 2012 that the overall price per die for 450 mm wafers would be cut by just 10-20% compared to 300 mm wafers. Switching to larger 450 mm wafers will lower die prices only for process procedures such as etch, whose cost is proportional to wafer count rather than wafer area. Lithography costs are proportionate to wafer area, hence larger wafers would not lower the lithography contribution to die cost. However the limitation posed with the higher cost of the product to hinder the wafer stripper market growth.

Wafer Stripper Market REGIONAL INSIGHTS

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"Asia Pacific Region to Lead the Market With Developed and Growing Semiconductor Market"

The Asia-Pacific area is a major region in the worldwide wafer stripper market share because it dominates the global semiconductor business, which is also backed by government initiatives. Additionally, Taiwan, China, Japan, and South Korea lead the region's semiconductor sector, accounting for a large share of the worldwide semiconductor market. Others, though, such as Thailand, Vietnam, Singapore, and Malaysia, contribute significantly to the region's market domination. China has the largest semiconductor market in Asia and the world. According to the semiconductor industry association, China will lead the semiconductor market with total chip sales of USD 192.5 billion in 2021, representing a 27.1% growth year on year. The country is also receiving large investments from numerous major chipmakers to enhance chip production by establishing new facilities.

KEY INDUSTRY PLAYERS

"Prominent Manufacturers to Contribute Towards Expansion of Market"

The report is an extensive research which presents the historic and futuristic performance of industry with competitive landscape analysis which incorporates prominent key players ,and revenue trends of industry. The report provides substantial analysis of company profiling, growth insights, supply-demand chain, production and consumption demand, business expansion strategies adopted by top key players. The information is a collusion of latest technological developments, trends, production lines mergers and acquisitions, market study and other factors.

List of Market Players Profiled

• Tokyo Electron Ltd. (Japan)
• Kingsemi (China)
• Beijing E-Town Semiconductor Technology Co., Ltd. (China)
• JET Plasma (China)
• PVA Tepla (U.S.A)
• Boffotto (China).

REPORT COVERAGE

The report anticipates a detailed analysis of the global market size at the regional and national level, the segmentation market growth and market share. The prime objective of the report is to help user understand the market in terms of definition, market potential, influencing trends, and the challenges faced by the market. Analysis of sales, the impact of the market players,  recent developments, opportunity analysis, strategic market growth analysis, territorial market expansion, and technological innovations are the subject matter explained in the report.